Forced Convection Drying Oven

Description

Forced convection drying oven uses heated airflow to efficiently bake products or materials. The key to its effectiveness is precise temperature control, even heat distribution, and the ability to maintain a controlled environment within the oven chamber. The oven typically consists of a heating element, a temperature control system, and a fan that circulates the hot air throughout the chamber. The fan helps distribute heat evenly, ensuring products receive the same amount of heat.

Specification

Feature

• Uniform temperature control

• Quickly heat and dry samples, able to heat samples up to 200°C

• Stainless steel sus#304 inner oven and powder-coated steel plate exterior oven, corrosion resistant

• Low energy consumption, cost saving

• PID digtal display controller brings you accurate and reliable temperature control

Structure

Forced convection drying oven generally consists of the following components:
• Interior Oven: Made of stainless steel SUS#304
• Insulation: Made of superfine glass wool, to minimize heat loss from the oven to the surroundings.
• Heating Element: Generates heat inside the oven.
• Circulation Fan: Circulates hot air inside the oven.
• Air Duct: The air duct is integrated with the fan, this ensures that the hot air flows through the oven continuously.
• Temperature Sensor: Measures the temperature within the oven.
• Control System: Regulates the temperature and timing of the drying process.
In operation, the heating element heats up the air, the air is then circulated by the fan through the air duct into the oven chamber, and finally out through the exhaust. This whole process ensures uniform heating and drying of the materials.

Application

Forced convection drying ovens are widely used in electronics manufacturing, these ovens are used to remove moisture from electronic components to restore their shelf life.

Here are a few examples of how drying ovens are applied in electronic manufacturing: Surface Mount Technology (SMT): During the SMT process, electronic components are mounted on PCBs (printed circuit boards) using a pick-and-place machine. After the components are placed, the boards go through a reflow oven where the solder paste is melted to connect the components to the board. Since the components and boards may absorb moisture during the process. A forced convection drying oven is used to remove any excess moisture and prevent potential failure due to moisture penetration.

Wave Soldering: Wave soldering involves passing the bottom of the PCB over a pool of molten solder, which creates a solid joint between the PCB and electronic components. Before wave soldering, the PCB is washed with water-soluble flux to remove any oxidation from the board. The PCB is then passed through a forced convection drying oven, this will remove remaining moisture before wave soldering so that the oxidation does not turn into contaminants during the soldering process.

Potting and Encapsulation: To protect electronic devices from moisture, it's common practice to coat the device with a potting or encapsulation material that is waterproof. These materials usually contain a curing process that requires high temperature baking to ensure the complete curing of the material. Placing the devices in the forced convection drying ovens could cure the potting or encapsulation material.

Solder Paste Application: Solder paste is commonly used to attach electronic components to PCB before reflow soldering. The paste is made of metal particles and flux which are mixed into a paste form. Since the solder paste absorbs moisture, it is critical to dry the paste before use. Baking ovens can remove any moisture from the solder paste to ensure it adheres correctly and doesn't cause weak solder joints.\

Forced convection drying ovens typically provide a controlled temperature environment, this is settable according to the specific temperature requirements. The ovens are able to operate at various temperature ranges from 50°C to 150°C, depending on the types of electronic components.

The baking process takes several hours, and during this time, the electronic components are exposed to the controlled environment. This allows the moisture absorbed by the components to evaporate, but still don’t damage the components.

After the baking process is complete, the electronic parts need to cool slowly to avoid thermal shock. The baked components are then sealed in moisture-free packaging to prevent moisture absorption again.

Overall, Forced convection drying ovens are essential in modern electronics manufacturing. These ovens help to avoid potential electronic failure by removing moisture from various stages of the manufacturing process. It is an optimal choice to restore the floor life of your electronic parts, and greatly improve your production efficiency.