Inert Atmosphere Ovens, also called Anaerobic ovens, are designed for heat treatment using non-oxidizing gases such as nitrogen in a sealing environment, it is suitable for heat treatment under low oxygen concentration atmosphere.
Description
Inert Atmosphere Oven series is used in semiconductor manufacturing for pretreatment baking of silicon wafers, gallium arsenide, lithium niobate, glass before PR coating, hard film baking after PR coating, and high-temperature baking after developing; It is also suitable for production and scientific research departments, such as electronic liquid crystal display, LCD, CMOS, IS and laboratories; it can also be used for drying, heat processing, aging and other high-temperature tests of non-volatile, non-flammable and non-explosive items.
Main Parameters
►Technical parameters
Capacity: Customized as per products
Temperature Range: Ambient+50°C ~ 250°C
Oxygen Content: ≤50ppm
Temperature Uniformity: ±2.5%
Ramp-up Rate: Controllable
Nitrogen Inlet: Φ8
Nitrogen flow: 0-240L/min * 2 channels
►Structure
. Interior oven: Made of stainless steel and seamless welded with argon gas.
. Hermetically sealed: The chamber is sealed to reduce oxygen levels.
. Air intake structure: Allows non-oxidizing gases to fill the chamber.
. O2 analyzer: Precisely adjust oxygen levels between 0.5~ 21%
► Temperature control system
Intelligent JAPAN RKC temperature controller, programs and fix value setting, AT auto-tuning, offset correction, and power-off retention.
► Forced air convection
The patented air duct in the hot air circulation system can automatically adjust the temperature unifomity.
Features for anaerobic (Inert) ovens
► Hermetically sealed stainless steel studio to prevent ingress of external atmosphere
► Use nitrogen inert gas for anaerobic heat treatment
► Flow meter and pressure gauge are equipped
► Multi-protection safety devices
Options
► PLC+7” programmable controller
► Three-color flashing light alarm
► Over-temperature limiter
► Manual safety devices
Why choose Inert Atmosphere Ovens?
Nowdays, wiring materials in circuits have shifted from aluminum to copper with lower resistivity. Therefore, when heat treated n a normal drying oven, copper parts can oxidize, causing defects. In addition, 250 deg C aging is also performed to check whether the data written on the flash memory has been deleted due to electromigration, and whether the bump parts are oxidized, so the oxygen content must be reduced to <100ppm. This anaerobic oven was developed to meet these demands.
Application
Inert Atmosphere Ovens are mainly used for BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MENS), FPD, high-precision electronic components and other materials in a low oxygen environment for drying and aging tests.
